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Journal: Metals, 2016
Volume: 6
Number: 92

Article: Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer
Authors: by Chien-Hsun Chuang, Yan-Cheng Lin and Che-Wei Lin
Link: https://www.mdpi.com/2075-4701/6/4/92

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