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Journal: Metals, 2024
Volume: 14
Number: 1420
Article:
Thermomigration Microstructure and Properties of Ni Nanoparticle-Reinforced Sn58Bi Composite Solder/Cu Solder Joint
Authors:
by
Yuchun Fan, Keke Zhang, Weiming Chen, Jinna Wu and Yonglei Wang
Link:
https://www.mdpi.com/2075-4701/14/12/1420
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