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Journal: Metals, 2024
Volume: 14
Number: 1149

Article: The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder
Authors: by Huihui Zhang, Zhefeng Xu, Yan Wang, Caili Tian, Changzeng Fan, Satoshi Motozuka and Jinku Yu
Link: https://www.mdpi.com/2075-4701/14/10/1149

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