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Journal: Metals, 2021
Volume: 11
Number: 61

Article: Recrystallization Behavior of a Pure Cu Connection Interface with Ultrasonic Welding
Authors: by Zhanzhan Su, Zhengqiang Zhu, Yifu Zhang, Hua Zhang and Qiankun Xiao
Link: https://www.mdpi.com/2075-4701/11/1/61

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