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Polymers 2014, 6(8), 2274-2286;

An Internally Heated Shape Memory Polymer Dry Adhesive

Department of Mechanical Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, IL 61801, USA
Author to whom correspondence should be addressed.
Received: 2 July 2014 / Revised: 14 August 2014 / Accepted: 14 August 2014 / Published: 22 August 2014
(This article belongs to the Special Issue Shape-Memory Polymers)
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A conductive epoxy-based shape memory polymer (SMP) is demonstrated using carbon black (CB) as a dopant for the purpose of creating an SMP dry adhesive system which can internally generate the heat required for activation. The electrical and mechanical properties of the CB/SMP blends for varying dopant concentrations are characterized. A composite adhesive is created to minimize surface contact resistance to conductive tape acting as electrodes, while maintaining bulk resistivity required for heat generation due to current flow. The final adhesive can function on flat or curved surfaces. As a demonstration, a 25 mm wide by 45 mm long dry adhesive strip is shown to heat evenly from an applied voltage, and can easily hold a mass in excess of 6 kg when bonded to a spherical concave glass surface using light pressure at 75 °C. View Full-Text
Keywords: shape-memory; dry adhesive; carbon black; epoxy; polymer shape-memory; dry adhesive; carbon black; epoxy; polymer

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This is an open access article distributed under the Creative Commons Attribution License (CC BY 3.0).

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Eisenhaure, J.; Kim, S. An Internally Heated Shape Memory Polymer Dry Adhesive. Polymers 2014, 6, 2274-2286.

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