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Polymers 2012, 4(3), 1478-1498;

Temperature-Responsive Polymer Modified Surface for Cell Sheet Engineering

Institute of Advanced Biomedical Engineering and Science, TWIns, Tokyo Women’s Medical University, 8-1 Kawada-cho, Shinjuku, Tokyo 162-8666, Japan
Author to whom correspondence should be addressed.
Received: 23 April 2012 / Revised: 17 July 2012 / Accepted: 30 July 2012 / Published: 15 August 2012
(This article belongs to the Special Issue Stimuli-Responsive Polymers and Colloids)
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In the past two decades, as a novel approach for tissue engineering, cell sheet engineering has been proposed by our laboratory. Poly(N-isopropylacrylamide) (PIPAAm), which is a well-known temperature-responsive polymer, has been grafted on tissue culture polystyrene (TCPS) surfaces through an electron beam irradiated polymerization. At 37 °C, where the PIPAAm modified surface is hydrophobic, cells can adhere, spread on the surface and grow to confluence. By decreasing temperature to 20 °C, since the surface turns to hydrophilic, cells can detach themselves from the surface spontaneously and form an intact cell sheet with extracellular matrix. For obtaining a temperature-induced cell attachment and detachment, it is necessary to immobilize an ultra thin PIPAAm layer on the TCPS surfaces. This review focuses on the characteristics of PIAPAm modified surfaces exhibiting these intelligent properties. In addition, PIPAAm modified surfaces giving a rapid cell-sheet recovery has been further developed on the basis of the characteristic of the PIPAAm surface. The designs of temperature-responsive polymer layer have provided an enormous potential to fabricate clinically applicable regenerative medicine. View Full-Text
Keywords: poly(N-isopropylacrylamide); temperature-responsive cell culture surface; cell sheet engineering poly(N-isopropylacrylamide); temperature-responsive cell culture surface; cell sheet engineering

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Tang, Z.; Akiyama, Y.; Okano, T. Temperature-Responsive Polymer Modified Surface for Cell Sheet Engineering. Polymers 2012, 4, 1478-1498.

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