Sung, Y.-C.; Hu, C.-P.; Hwang, S.-J.; Shih, M.-H.; Liao, W.-H.; Zeng, Y.-J.; Tsai, C.-T.
Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. Polymers 2025, 17, 2034.
https://doi.org/10.3390/polym17152034
AMA Style
Sung Y-C, Hu C-P, Hwang S-J, Shih M-H, Liao W-H, Zeng Y-J, Tsai C-T.
Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. Polymers. 2025; 17(15):2034.
https://doi.org/10.3390/polym17152034
Chicago/Turabian Style
Sung, Yu-Chi, Chih-Ping Hu, Sheng-Jye Hwang, Ming-Hsien Shih, Wen-Hsiang Liao, Yong-Jie Zeng, and Cheng-Tse Tsai.
2025. "Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity" Polymers 17, no. 15: 2034.
https://doi.org/10.3390/polym17152034
APA Style
Sung, Y.-C., Hu, C.-P., Hwang, S.-J., Shih, M.-H., Liao, W.-H., Zeng, Y.-J., & Tsai, C.-T.
(2025). Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity. Polymers, 17(15), 2034.
https://doi.org/10.3390/polym17152034
