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Journal: Polymers, 2025
Volume: 17
Number: 1301

Article: Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame
Authors: by Ting-Yu Lee, Yu-Li Chen, Sheng-Jye Hwang, Wei-Lun Cheng and Chun-Yu Ko
Link: https://www.mdpi.com/2073-4360/17/10/1301

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