Wang, Y.; Jing, D.; Xiong, Z.; Hu, Y.; Li, W.; Wu, H.; Zuo, C.
Ag-MWCNT Composites for Improving the Electrical and Thermal Properties of Electronic Paste. Polymers 2024, 16, 1173.
https://doi.org/10.3390/polym16081173
AMA Style
Wang Y, Jing D, Xiong Z, Hu Y, Li W, Wu H, Zuo C.
Ag-MWCNT Composites for Improving the Electrical and Thermal Properties of Electronic Paste. Polymers. 2024; 16(8):1173.
https://doi.org/10.3390/polym16081173
Chicago/Turabian Style
Wang, Yunkai, Danlei Jing, Zikai Xiong, Yongqing Hu, Wei Li, Haotian Wu, and Chuan Zuo.
2024. "Ag-MWCNT Composites for Improving the Electrical and Thermal Properties of Electronic Paste" Polymers 16, no. 8: 1173.
https://doi.org/10.3390/polym16081173
APA Style
Wang, Y., Jing, D., Xiong, Z., Hu, Y., Li, W., Wu, H., & Zuo, C.
(2024). Ag-MWCNT Composites for Improving the Electrical and Thermal Properties of Electronic Paste. Polymers, 16(8), 1173.
https://doi.org/10.3390/polym16081173