Lee, J.-Y.; Oh, M.-H.; Park, J.-H.; Kang, S.-H.; Kang, S.-K.
Three-Dimensionally Printed Expandable Structural Electronics Via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV. Polymers 2023, 15, 2003.
https://doi.org/10.3390/polym15092003
AMA Style
Lee J-Y, Oh M-H, Park J-H, Kang S-H, Kang S-K.
Three-Dimensionally Printed Expandable Structural Electronics Via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV. Polymers. 2023; 15(9):2003.
https://doi.org/10.3390/polym15092003
Chicago/Turabian Style
Lee, Ju-Yong, Min-Ha Oh, Joo-Hyeon Park, Se-Hun Kang, and Seung-Kyun Kang.
2023. "Three-Dimensionally Printed Expandable Structural Electronics Via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV" Polymers 15, no. 9: 2003.
https://doi.org/10.3390/polym15092003
APA Style
Lee, J.-Y., Oh, M.-H., Park, J.-H., Kang, S.-H., & Kang, S.-K.
(2023). Three-Dimensionally Printed Expandable Structural Electronics Via Multi-Material Printing Room-Temperature-Vulcanizing (RTV) Silicone/Silver Flake Composite and RTV. Polymers, 15(9), 2003.
https://doi.org/10.3390/polym15092003