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Journal: Polymers, 2023
Volume: 15
Number: 3895

Article: A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates
Authors: by Pratik Nimbalkar, Pragna Bhaskar, Mohanalingam Kathaperumal, Madhavan Swaminathan and Rao R. Tummala
Link: https://www.mdpi.com/2073-4360/15/19/3895

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