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Journal: Polymers, 2022
Volume: 14
Number: 3373

Article: Nondestructive Evaluation of Composite Bonding Structure Used in Electrical Insulation Based on Active Infrared Thermography
Authors: by Chenjun Guo, Lishuai Liu, Hongwei Mei, Yanxin Tu and Liming Wang
Link: https://www.mdpi.com/2073-4360/14/16/3373

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