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Journal: Polymers, 2022
Volume: 14
Number: 2304
Article:
Utilization of Suberinic Acids Containing Residue as an Adhesive for Particle Boards
Authors:
by
Raimonds Makars, Janis Rizikovs, Daniela Godina, Aigars Paze and Remo Merijs-Meri
Link:
https://www.mdpi.com/2073-4360/14/11/2304
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