Qi, L.; Guo, C.-Y.; Huang Fu, M.-G.; Zhang, Y.; Yin, L.-m.; Wu, L.; Liu, J.-g.; Zhang, X.-m.
Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish. Polymers 2019, 11, 2055.
https://doi.org/10.3390/polym11122055
AMA Style
Qi L, Guo C-Y, Huang Fu M-G, Zhang Y, Yin L-m, Wu L, Liu J-g, Zhang X-m.
Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish. Polymers. 2019; 11(12):2055.
https://doi.org/10.3390/polym11122055
Chicago/Turabian Style
Qi, Lin, Chen-Yu Guo, Meng-Ge Huang Fu, Yan Zhang, Lu-meng Yin, Lin Wu, Jin-gang Liu, and Xiu-min Zhang.
2019. "Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish" Polymers 11, no. 12: 2055.
https://doi.org/10.3390/polym11122055
APA Style
Qi, L., Guo, C.-Y., Huang Fu, M.-G., Zhang, Y., Yin, L.-m., Wu, L., Liu, J.-g., & Zhang, X.-m.
(2019). Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish. Polymers, 11(12), 2055.
https://doi.org/10.3390/polym11122055
