Gao, X.; Huang, Y.; He, X.; Fan, X.; Liu, Y.; Xu, H.; Wu, D.; Wan, C.
Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process. Polymers 2019, 11, 56.
https://doi.org/10.3390/polym11010056
AMA Style
Gao X, Huang Y, He X, Fan X, Liu Y, Xu H, Wu D, Wan C.
Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process. Polymers. 2019; 11(1):56.
https://doi.org/10.3390/polym11010056
Chicago/Turabian Style
Gao, Xiaolong, Yao Huang, Xiaoxiang He, Xiaojing Fan, Ying Liu, Hong Xu, Daming Wu, and Chaoying Wan.
2019. "Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process" Polymers 11, no. 1: 56.
https://doi.org/10.3390/polym11010056
APA Style
Gao, X., Huang, Y., He, X., Fan, X., Liu, Y., Xu, H., Wu, D., & Wan, C.
(2019). Mechanically Enhanced Electrical Conductivity of Polydimethylsiloxane-Based Composites by a Hot Embossing Process. Polymers, 11(1), 56.
https://doi.org/10.3390/polym11010056