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Open AccessArticle

Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package

1
Institute of Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, 1037 Luoyu Road, Wuhan 430074, China
2
School of Mechanical and Electrical Engineering, Hohai University, 200 Jinling Bei Road, Changzhou 213022, China
*
Author to whom correspondence should be addressed.
Polymers 2018, 10(2), 195; https://doi.org/10.3390/polym10020195
Received: 12 January 2018 / Revised: 7 February 2018 / Accepted: 11 February 2018 / Published: 15 February 2018
(This article belongs to the Special Issue Mechanics of Emerging Polymers with Unprecedented Networks)
Mass fraction of phosphor in silicone and aging time play important roles in the optics and mechanical performance of the silicone that is used in the light emitting diode (LED) package. In this paper, the mechanical properties of silicone/phosphor composites are investigated experimentally by separate tensile and compression tests. Distribution of the phosphors is observed by scanning electron microscopy (SEM) to ensure the homogeneity of the samples. Different loading rates are applied to study the silicone material’s rate-dependent properties. The experimental results of the tensile and compression test show that the Young’s modulus increases with the mass fraction of phosphor in silicone. Longer aging time stiffens the silicone composite and weakens the ductility of the materials. A three-dimensional model used cohesive zone material (CZM) between the interface of the phosphor particles, and matrix silicone is built up to study the degradation mechanism at a micro-scale level. The simulation results indicate that the diameter of particles in silicone also impacts its interface debonding and crack growth. The theoretical results concerning the mass fraction of phosphor are in good agreement with the experiments. View Full-Text
Keywords: mechanical properties; aging; CZM; interface debonding mechanical properties; aging; CZM; interface debonding
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MDPI and ACS Style

Pan, Y.; Zhu, F.; Fan, J.; Tao, J.; Lin, X.; Wang, F.; Shi, L. Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package. Polymers 2018, 10, 195. https://doi.org/10.3390/polym10020195

AMA Style

Pan Y, Zhu F, Fan J, Tao J, Lin X, Wang F, Shi L. Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package. Polymers. 2018; 10(2):195. https://doi.org/10.3390/polym10020195

Chicago/Turabian Style

Pan, Yongjun; Zhu, Fulong; Fan, Jiajie; Tao, Jiaquan; Lin, Xinxin; Wang, Fengren; Shi, Lang. 2018. "Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package" Polymers 10, no. 2: 195. https://doi.org/10.3390/polym10020195

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