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Chen C-H, Lee K-W, Lin C-H, Ho M-J, Hsu M-F, Hsiang S-J, Huang N-K, Juang T-Y. High-T_g, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides. Polymers. 2018; 10(1):27. https://doi.org/10.3390/polym10010027

Chen, Chien-Han, Kuan-Wei Lee, Ching-Hsuan Lin, Ming-Jaan Ho, Mao-Feng Hsu, Shou-Jui Hsiang, Nan-Kun Huang, and Tzong-Yuan Juang. 2018. "High-T_g, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides" Polymers 10, no. 1: 27. https://doi.org/10.3390/polym10010027

Chen, C.-H., Lee, K.-W., Lin, C.-H., Ho, M.-J., Hsu, M.-F., Hsiang, S.-J., Huang, N.-K., & Juang, T.-Y. (2018). High-T_g, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides. Polymers, 10(1), 27. https://doi.org/10.3390/polym10010027