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Crystals 2018, 8(12), 441; https://doi.org/10.3390/cryst8120441

R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations

1
College of Mechanics and Materials, Hohai University, Nanjing 211100, China
2
Department of Mechanical Engineering, Inha University, Incheon 402-751, Korea
*
Author to whom correspondence should be addressed.
Received: 19 October 2018 / Revised: 21 November 2018 / Accepted: 22 November 2018 / Published: 26 November 2018
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Abstract

The technique of molecular statics (MS) simulation was employed to determine the crack growth resistance curve of Cu and Ni single crystals. Copper and Ni single crystal nanoplates with an edge crack subjected to a tensile displacement were simulated. Stress-displacement curves and snapshots of the atomic configuration corresponding to different displacement levels were presented to elucidate the deformation mechanism. It was observed that the edge crack propagated step by step in a brittle manner, and the amount of crack growth at each step was half the lattice parameter. Through an energy consideration, the critical strain energy release rate at the onset of crack propagation and the crack growth resistance were calculated. The crack growth resistance is larger than the critical strain energy release rate because of the crack growth effect. View Full-Text
Keywords: atomistic simulation; copper; nickel; R-curve atomistic simulation; copper; nickel; R-curve
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Zhuo, X.R.; Kim, J.H.; Beom, H.G. R-curve Evaluation of Copper and Nickel Single Crystals Using Atomistic Simulations. Crystals 2018, 8, 441.

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