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Journal: Crystals, 2022
Volume: 12
Number: 924

Article: Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy
Authors: by Lu Liu, Songbai Xue, Ruiyang Ni and Peng Zhang
Link: https://www.mdpi.com/2073-4352/12/7/924

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