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Journal: Crystals, 2021
Volume: 11
Number: 733
Article:
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment
Authors:
by
Lu Liu, Songbai Xue, Ruiyang Ni, Peng Zhang and Jie Wu
Link:
https://www.mdpi.com/2073-4352/11/7/733
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