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Journal: Micromachines, 2018
Volume: 9
Number: 519
Article:
Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication
Authors:
by
Kangmin Leng, Chuanfei Guo, Kang Wu and Zhigang Wu
Link:
https://www.mdpi.com/2072-666X/9/10/519
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