A Review of Three-Dimensional Electric Field Sensors
Abstract
1. Introduction
2. Field Mill 3D DC EFSs
2.1. Working Principle
2.2. Prototype Instantiation for Field Mill 3D DC EFSs
3. 3D Optical EFSs
3.1. Working Principle
3.2. Prototype Instantiation for 3D Optical EFSs
4. 3D Capacitive EFSs
4.1. Working Principle
4.2. Prototype Instantiation for 3D Capacitive EFSs
5. MEMS 3D EFSs
5.1. Working Principle and Classification
5.2. Prototype Instantiation for MEMS 3D EFSs
5.2.1. Single-Chip 3D MEMS EFSs
5.2.2. Assembled 3D MEMS EFSs
5.3. System-Level Integration and Application
6. Decoupling Calibration Method
6.1. Decoupled Calibration Matrix
6.2. Calibration Method
- Calibration system construction: Construct a calibration system that can precisely regulate the direction and intensity of the electric field. This generally comprises a device that produces a uniform electric field and a rotating mechanism capable of firmly affixing and accurately rotating the sensor. The rotating apparatus often includes one or more orthogonal axes of rotation, enabling the sensor to be calibrated from various perspectives.
- Data collection: Install the sensor within the calibration system and document the output data of the sensor under varying electric field orientations and intensities. It is imperative to maintain the consistency and stability of the electric field, together with the precise positioning and orientation of the sensor, during the data collection process.
- Calculation of theoretical components: The theoretical components of the electric field in the sensor’s local coordinate system are computed based on the rotation angle and electric field strength, utilizing geometric relationships and electric field theory. These theoretical components will provide the foundation for comparison and calibration throughout the process.
- Coupling matrix calculation: The gathered sensor output data and the computed theoretical electric field components are utilized to determine the coupling matrix via mathematical techniques, including the least squares method, genetic algorithm [78], and differential evolution algorithm [79]. The calculation of the coupling matrix constitutes an optimization problem aimed at identifying a matrix that minimizes the discrepancy between the sensor output, as transformed by the matrix, and the theoretical electric field components.
- Calibration result verification: The coupling matrix derived from calibration is used to execute an inverse computation on the sensor’s output under alternative known conditions, thus acquiring the computed value of the electric field. The computed value is subsequently compared with the actual applied electric field value. The precision of the calibration outcome is assessed by computing the error (e.g., relative error, absolute error, etc.).
6.3. Calibration Applications and Limitations
- Environmental parameter drift: (a) Mechanical vibration interference: Motor vibrations induce irregular rotor motion, which disrupts the periodic shielding of the shielding structure and sensing plate, hence impacting the calibration of the decoupling matrix [38]. (b) Temperature drift: The Pockels effect in lithium niobate is influenced by temperature, although this is not dynamically corrected within the matrix, hence impacting calibration [49]. (c) Effects of humidity: Variations in environmental humidity induce drift in the dielectric constant, modifying capacitance values and leading to alterations in the sensitivity matrix. (d) Ground potential fluctuations: Conventional wired transmission induces variations in the ground potential of the signal conditioning circuit, hence impacting the precision of matrix calibration.
- Calibration system errors: (a) Non-uniformity of the electric field: Edge effects in parallel plate calibration devices induce distortions in field strength, hence impacting matrix calibration.
7. Discussion
7.1. Current Advancements and Applications
7.2. Challenges and Limitations
- Sensitivity and resolution: Current 3D EFSs generally exhibit limited sensitivity and fail to satisfy the stringent detection demands for weak electric fields in domains such as biomedical imaging and nanoelectronics. Investigating novel sensing materials, refining sensor architectures, augmenting signal processing technologies, and further elevating sensitivity and resolution will be essential avenues for the future advancement of 3D EFSs.
- Miniaturization and integration: Despite the advancements in MEMS technology facilitating the downsizing of 3D EFSs, numerous technical obstacles persist. The completed structure remains cumbersome due to the necessity of incorporating three electric field-sensitive chips, whereas single-chip packaging can modify the electric field distribution. Consequently, no viable solution has been established thus far. Attaining downsizing while maintaining sensor performance and reliability is a primary focus of contemporary research.
- Inter-axis coupling interference: The output signal of each measurement axis in a 3D EFS is often affected by the electric field components from the other two orthogonal axes. This inter-axis coupling effect significantly impacts measurement accuracy. Although some studies have explored methods such as decoupling matrices and symmetrical structures combined with differential circuits to reduce coupling interference, these approaches still cannot fully eliminate the issue.
- Space charge interference: In practical settings, space charge can result in charge accumulation on the sensor surface, hence impacting the precision of electric field measurements. While certain studies have suggested techniques, such as differential computations, to alleviate the effects of charge accumulation, investigations into the processes of space charge interference and related remedies are still scarce.
7.3. Future Research Directions
- AI-augmented signal processing: Deep learning algorithms, including convolutional neural networks [88,89] and long short-term memory networks [90], can be developed to denoise, identify patterns, and extract features from raw electric field signals, thereby enhancing the detection sensitivity and precision of weak electric field signals. AI models can be trained to identify anomalous signals in real time by learning to detect nonlinear disturbances in electric fields within intricate surroundings.
- Multi-source sensor fusion: The integration of 3D EFSs with environmental sensors, including temperature, humidity, and barometric pressure, alongside the application of fusion algorithms for the collaborative processing of multi-source data [91], effectively mitigates the interference caused by fluctuations in environmental parameters on electric field measurements. This enhances the system’s robustness and adaptability, making it particularly applicable for meteorological monitoring, disaster warning, and related domains.
- Smart medical/environmental system-level integration applications: Three-dimensional EFSs can be integrated with wearable devices or implantable biosensors for the detection of human electrophysiological signals [92], such as cerebral or cardiac electric fields, thereby facilitating epilepsy prediction [93] and arrhythmia diagnosis. In environmental contexts, these sensors can be incorporated into edge AI devices [94] to enable intelligent monitoring and response to electromagnetic pollution, thunderstorm risks, and other environmental hazards.
- 3D EFS productization/standardization: The productization and standardization of 3D EFSs necessitate the assistance of standardization efforts for their minimization and integration. This necessitates a robust emphasis on the authoritative function of international standards. Applicable standards, including IEEE 1309 [80], IEC 61786 [64], and the IEC 61000 series [95], offer essential rules and frameworks for the accurate calibration, performance assessment, electromagnetic compatibility validation, and final productization and standardization of sensors. Complying with and citing these standards is crucial for improving the environmental adaptability and market competitiveness of 3D EFSs.
8. Conclusions
Funding
Conflicts of Interest
References
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3D EFSs | Sensitivity/Cross-Axis Sensitivity | Measurement Range | Ref. | Advantages and Disadvantages |
---|---|---|---|---|
DC field mill | 2 V/m | / | [32] | Advantages: High stability, strong anti-interference ability. Disadvantage: Narrow frequency band, mechanical wear, High power consumption. |
50 V/m | ±30 kV/m | [35] | ||
10 V/m | / | [37] | ||
Optical | / | [45] | Advantages: Non-contact measurement, strong anti-electromagnetic interference capability. Disadvantage: High cost, susceptible to temperature. | |
X: 1.1 mV/kV/m Y: 1.7 mV/kV/m Z: 1.4 mV/kV/m | 15–370 kV/m | [47] | ||
Maximum up to 6.5 MV/m | [50] | |||
X: 0.908 mV/kV/m Y: 1.043 mV/kV/m Z: 0.781 mV/kV/m | X: 3.71 kV/m–388 kV/m Y: 2.78 kV/m–403 kV/m Z: 4.50 kV/m–375 kV/m | [51] | ||
/ | 8–60 kV/m | [52] | ||
0.0291 mV/(kV/m) | 5 kV/m–50 kV/m | [53] | ||
Capacitive | 3.03 mV/kV/m | <12 kV/m | [57] | Advantages: Broadband measurements, AC measurements. Disadvantage: Limited measuring range, weak anti-interference ability. |
19.10 mV/(kV · m−1) | 1 kV/m–200 kV/m | [60] | ||
0.1 mV/m 1 mV/m | 5 mV/m–1 kV/m 500 mV/m–100 kV/m | / | ||
MEMS | 0–50 kV/m | [66] | Advantages: Miniaturization, high sensitivity, low power consumption. Disadvantage: High manufacturing costs. | |
X: 0.2315 mV/kV/m Y: 0.3727 mV/kV/m Z: 2.187 mV/kV/m | 0–50 kV/m | [68] | ||
5.48% | 0–120 kV/m | [70] | ||
19.54% | 0–120 kV/m | [71] | ||
14.78 mV · kV−1 | / | [73] |
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Li, X.; Gu, Y.; Li, Z.; He, Z.; Yang, P.; Peng, C. A Review of Three-Dimensional Electric Field Sensors. Micromachines 2025, 16, 737. https://doi.org/10.3390/mi16070737
Li X, Gu Y, Li Z, He Z, Yang P, Peng C. A Review of Three-Dimensional Electric Field Sensors. Micromachines. 2025; 16(7):737. https://doi.org/10.3390/mi16070737
Chicago/Turabian StyleLi, Xiaonan, Yu Gu, Zehao Li, Zijian He, Pengfei Yang, and Chunrong Peng. 2025. "A Review of Three-Dimensional Electric Field Sensors" Micromachines 16, no. 7: 737. https://doi.org/10.3390/mi16070737
APA StyleLi, X., Gu, Y., Li, Z., He, Z., Yang, P., & Peng, C. (2025). A Review of Three-Dimensional Electric Field Sensors. Micromachines, 16(7), 737. https://doi.org/10.3390/mi16070737