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Chung S-H, Yeom H-S, Kim C-H, Kim Y-K, Lee S-K, Baek C-W, Park J-H. Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. Micromachines. 2025; 16(1):12. https://doi.org/10.3390/mi16010012

Chung, Seung-Han, Ho-Sun Yeom, Che-Heung Kim, Yong-Kweon Kim, Seung-Ki Lee, Chang-Wook Baek, and Jae-Hyoung Park. 2025. "Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications" Micromachines 16, no. 1: 12. https://doi.org/10.3390/mi16010012

Chung, S.-H., Yeom, H.-S., Kim, C.-H., Kim, Y.-K., Lee, S.-K., Baek, C.-W., & Park, J.-H. (2025). Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. Micromachines, 16(1), 12. https://doi.org/10.3390/mi16010012