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Journal: Micromachines, 2024
Volume: 15
Number: 986

Article: Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
Authors: by Wenchao Tian, Haojie Dang, Dexin Li, Yunhao Cong and Yuanming Chen
Link: https://www.mdpi.com/2072-666X/15/8/986

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