Order Article Reprints
Journal: Micromachines, 2024
Volume: 15
Number: 986
Article:
Reliability Simulation Analysis of TSV Structure in Silicon Interposer under Temperature Cycling
Authors:
by
Wenchao Tian, Haojie Dang, Dexin Li, Yunhao Cong and Yuanming Chen
Link:
https://www.mdpi.com/2072-666X/15/8/986
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover
and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article
and designed to be complimentary to the journal.