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Journal: Micromachines, 2024
Volume: 15
Number: 422

Article: Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
Authors: by Yongkun Wang, Haozheng Liu, Linghua Huo, Haobin Li, Wenchao Tian, Haoyue Ji and Si Chen
Link: https://www.mdpi.com/2072-666X/15/4/422

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