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Journal: Micromachines, 2024
Volume: 15
Number: 1436

Article: Low-Temperature Bonding for Heterogeneous Integration of Silicon Chips with Nanocrystalline Diamond Films
Authors: by Jicun Lu, Xiaochun Lv, Chenghao Zhang, Chuting Zhang and Yang Liu
Link: https://www.mdpi.com/2072-666X/15/12/1436

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