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Journal: Micromachines, 2024
Volume: 15
Number: 1231

Article: Fabrication of Electrospun Porous TiO2 Dielectric Film in a Ti–TiO2–Si Heterostructure for Metal–Insulator–Semiconductor Capacitors
Authors: by Jin-Uk Yoo, Tae-Min Choi and Sung-Gyu Pyo
Link: https://www.mdpi.com/2072-666X/15/10/1231

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