Lai, L.; Yu, G.; Wang, G.; Li, Y.; Ding, G.; Yang, Z.
Application of Ni/SiCw Composite Material in MEMS Microspring. Micromachines 2023, 14, 1767.
https://doi.org/10.3390/mi14091767
AMA Style
Lai L, Yu G, Wang G, Li Y, Ding G, Yang Z.
Application of Ni/SiCw Composite Material in MEMS Microspring. Micromachines. 2023; 14(9):1767.
https://doi.org/10.3390/mi14091767
Chicago/Turabian Style
Lai, Liyan, Guanliang Yu, Guilian Wang, Yigui Li, Guifu Ding, and Zhuoqing Yang.
2023. "Application of Ni/SiCw Composite Material in MEMS Microspring" Micromachines 14, no. 9: 1767.
https://doi.org/10.3390/mi14091767
APA Style
Lai, L., Yu, G., Wang, G., Li, Y., Ding, G., & Yang, Z.
(2023). Application of Ni/SiCw Composite Material in MEMS Microspring. Micromachines, 14(9), 1767.
https://doi.org/10.3390/mi14091767