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Journal: Micromachines, 2023
Volume: 14
Number: 1500

Article: Fiber-to-Chip Three-Dimensional Silicon-on-Insulator Edge Couplers with High Efficiency and Tolerance
Authors: by Xiaoyu Li, Shengtao Yu and Chengqun Gui
Link: https://www.mdpi.com/2072-666X/14/8/1500

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