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Journal: Micromachines, 2023
Volume: 14
Number: 1493

Article: Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
Authors: by Xianglong Wang, Jiaming Su, Dongdong Chen, Di Li, Gaoliang Li and Yintang Yang
Link: https://www.mdpi.com/2072-666X/14/8/1493

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