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Journal: Micromachines, 2023
Volume: 14
Number: 1491

Article: Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends
Authors: by Liyan Lai, Bing Niu, Yuxiao Bi, Yigui Li and Zhuoqing Yang
Link: https://www.mdpi.com/2072-666X/14/8/1491

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