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Journal: Micromachines, 2023
Volume: 14
Number: 1475
1475
Article: Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat Sink
Authors: by Muhammad Teham Tahir, Shahzaib Anwar, Naseem Ahmad, Mariyam Sattar, Usama Waleed Qazi, Usman Ghafoor and Muhammad Raheel Bhutta
Link: https://www.mdpi.com/2072-666X/14/7/1475

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