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Journal: Micromachines, 2023
Volume: 14
Number: 1448
1448
Article: Silicon Micromachined TSVs for Backside Interconnection of Ultra-Small Pressure Sensors
Authors: by Weiwen Feng, Peng Li, Haozhi Zhang, Ke Sun, Wei Li, Jiachou Wang, Heng Yang and Xinxin Li
Link: https://www.mdpi.com/2072-666X/14/7/1448

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