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Journal: Micromachines, 2023
Volume: 14
Number: 1365

Article: Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration
Authors: by Maria Lykova, Iuliana Panchenko, Martin Schneider-Ramelow, Tadatomo Suga, Fengwen Mu and Roy Buschbeck
Link: https://www.mdpi.com/2072-666X/14/7/1365

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