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Journal: Micromachines, 2023
Volume: 14
Number: 1297
1297
Article: Comparison of Anodic and Au-Au Thermocompression Si-Wafer Bonding Methods for High-Pressure Microcooling Devices
Authors: by Sylwester Bargiel, Julien Cogan, Samuel Queste, Stefania Oliveri, Ludovic Gauthier-Manuel, Marina Raschetti, Olivier Leroy, Stéphan Beurthey and Mathieu Perrin-Terrin
Link: https://www.mdpi.com/2072-666X/14/7/1297

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