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Journal: Micromachines, 2023
Volume: 14
Number: 1245

Article: Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP
Authors: by Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan and Zhao Zhang
Link: https://www.mdpi.com/2072-666X/14/6/1245

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