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Journal: Micromachines, 2023
Volume: 14
Number: 1245
Article:
Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP
Authors:
by
Lei Yan, Peisheng Liu, Pengpeng Xu, Lipeng Tan and Zhao Zhang
Link:
https://www.mdpi.com/2072-666X/14/6/1245
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