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Journal: Micromachines, 2023
Volume: 14
Number: 1131
Article:
Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications
Authors:
by
Ratul Kumar Baruah, Hocheon Yoo and Eun Kwang Lee
Link:
https://www.mdpi.com/2072-666X/14/6/1131
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