Order Article Reprints

Li X, Gao L, Ni T, Zhou J, Li X, Li Y, Xu L, Wang R, Zeng C, Li B, et al. Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method. Micromachines. 2023; 14(3):640. https://doi.org/10.3390/mi14030640

Li, Xueqin, Linchun Gao, Tao Ni, Jingnan Zhou, Xiaojing Li, Yifan Li, Lida Xu, Runjian Wang, Chuanbin Zeng, Bo Li, and et al. 2023. "Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method" Micromachines 14, no. 3: 640. https://doi.org/10.3390/mi14030640

Li, X., Gao, L., Ni, T., Zhou, J., Li, X., Li, Y., Xu, L., Wang, R., Zeng, C., Li, B., Luo, J., & Li, J. (2023). Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method. Micromachines, 14(3), 640. https://doi.org/10.3390/mi14030640