Li, X.; Gao, L.; Ni, T.; Zhou, J.; Li, X.; Li, Y.; Xu, L.; Wang, R.; Zeng, C.; Li, B.;
et al. Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method. Micromachines 2023, 14, 640.
https://doi.org/10.3390/mi14030640
AMA Style
Li X, Gao L, Ni T, Zhou J, Li X, Li Y, Xu L, Wang R, Zeng C, Li B,
et al. Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method. Micromachines. 2023; 14(3):640.
https://doi.org/10.3390/mi14030640
Chicago/Turabian Style
Li, Xueqin, Linchun Gao, Tao Ni, Jingnan Zhou, Xiaojing Li, Yifan Li, Lida Xu, Runjian Wang, Chuanbin Zeng, Bo Li,
and et al. 2023. "Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method" Micromachines 14, no. 3: 640.
https://doi.org/10.3390/mi14030640
APA Style
Li, X., Gao, L., Ni, T., Zhou, J., Li, X., Li, Y., Xu, L., Wang, R., Zeng, C., Li, B., Luo, J., & Li, J.
(2023). Analysis of Degradation of Electromigration Reliability of Au-Al and OPM Wire Bonded Contacts at 250 °C Using Resistance Monitoring Method. Micromachines, 14(3), 640.
https://doi.org/10.3390/mi14030640
