Article Versions Notes

Hong K-B, Peng C-Y, Lin W-C, Chen K-L, Chen S-C, Kuo H-C, Chang EY, Lin C-H. Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer. Micromachines. 2023; 14(3):519. https://doi.org/10.3390/mi14030519

Hong, Kuo-Bin, Chun-Yen Peng, Wei-Cheng Lin, Kuan-Lun Chen, Shih-Chen Chen, Hao-Chung Kuo, Edward Yi Chang, and Chun-Hsiung Lin. 2023. "Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer" Micromachines 14, no. 3: 519. https://doi.org/10.3390/mi14030519

Hong, K.-B., Peng, C.-Y., Lin, W.-C., Chen, K.-L., Chen, S.-C., Kuo, H.-C., Chang, E. Y., & Lin, C.-H. (2023). Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer. Micromachines, 14(3), 519. https://doi.org/10.3390/mi14030519