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Journal: Micromachines, 2023
Volume: 14
Number: 475

Article: Conduction Conditions for Self-Healing of Metal Interconnect Using Copper Microparticles Dispersed with Silicone Oil
Authors: by Naoki Suetsugu and Eiji Iwase
Link: https://www.mdpi.com/2072-666X/14/2/475

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