Article Versions Notes

Zhang Y, Hou Z, Si C, Han G, Zhao Y, Lu X, Liu J, Ning J, Yang F. Effects of Mask Material on Lateral Undercut of Silicon Dry Etching. Micromachines. 2023; 14(2):306. https://doi.org/10.3390/mi14020306

Zhang, Yongkang, Zhongxuan Hou, Chaowei Si, Guowei Han, Yongmei Zhao, Xiaorui Lu, Jiahui Liu, Jin Ning, and Fuhua Yang. 2023. "Effects of Mask Material on Lateral Undercut of Silicon Dry Etching" Micromachines 14, no. 2: 306. https://doi.org/10.3390/mi14020306

Zhang, Y., Hou, Z., Si, C., Han, G., Zhao, Y., Lu, X., Liu, J., Ning, J., & Yang, F. (2023). Effects of Mask Material on Lateral Undercut of Silicon Dry Etching. Micromachines, 14(2), 306. https://doi.org/10.3390/mi14020306