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Journal: Micromachines, 2022
Volume: 13
Number: 908

Article: Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization
Authors: by Shaoyi Liu, Yuefei Yan, Yijiang Zhou, Baoqing Han, Benben Wang, Daxing Zhang, Song Xue, Zhihai Wang, Kunpeng Yu, Yu Shi and Congsi Wang
Link: https://www.mdpi.com/2072-666X/13/6/908

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