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Journal: Micromachines, 2022
Volume: 13
Number: 867

Article: A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
Authors: by Lingyao Sun, Zhenhua Guo, Xiuchen Zhao, Ying Liu, Kingning Tu and Yingxia Liu
Link: https://www.mdpi.com/2072-666X/13/6/867

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