Next Article in Journal
Photocatalytic Material-Microorganism Hybrid System and Its Application—A Review
Next Article in Special Issue
Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization
Previous Article in Journal
Robust Adaptive Beamforming Algorithm for Sparse Subarray Antenna Array Based on Hierarchical Weighting
 
 

Order Article Reprints

Journal: Micromachines, 2022
Volume: 13
Number: 860

Article: Investigation on SMT Product Defect Recognition Based on Multi-Source and Multi-Dimensional Data Reconstruction
Authors: by Jiantao Chang, Zixuan Qiao, Qibin Wang, Xianguang Kong and Yunsong Yuan
Link: https://www.mdpi.com/2072-666X/13/6/860

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop