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Journal: Micromachines, 2022
Volume: 13
Number: 776
Article:
Simulation of Temperature Field in Micro-EDM Assisted Machining of Micro-Holes in Printed Circuit Boards
Authors:
by
Manqun Lian, Xinke Feng, Bin Xu, Lianyu Fu and Kai Jiang
Link:
https://www.mdpi.com/2072-666X/13/5/776
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