Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus
1
School of Biotechnology, Dublin City University, Dublin 9, Ireland
2
The National Centre for Sensor Research (NCSR), Research & Engineering Building, Dublin City University, Dublin 9, Ireland
3
Photonics Systems and Sensing Laboratory, School of Electronic Engineering, Dublin City University, Dublin 9, Ireland
4
School of Electronic Engineering, Dublin City University, Dublin 9, Ireland
*
Author to whom correspondence should be addressed.
Micromachines 2020, 11(11), 1019; https://doi.org/10.3390/mi11111019
Received: 2 November 2020
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Revised: 16 November 2020
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Accepted: 18 November 2020
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Published: 20 November 2020
(This article belongs to the Special Issue Next Generation RFID Transponders)
To date, no printable chipless Radio Frequency Identification (RFID) sensor-related publications in the current literature discuss the possibility of thermocouple integration, particularly for the use in extreme environments. Furthermore, the effects of a time-dependent stimulus on the scattering parameters of a chipless RFID have never been discussed in the known literature. This work includes a review of possible methods to achieve this goal and the design and characterization of a Barium Strontium Titanate (BST) based VHF/UHF voltage sensing circuit. Proof-of-concept thermocouple integration was attempted, and subsequent testing was performed using a signal generator. These subsequent tests involved applying ramp and sinusoid voltage waveforms to the circuit and the characteristics of these signals are largely extracted from the scattering response. Overall conclusions of this paper are that thermocouple integration into chipless RFID technology is still a significant challenge and further work is needed to identify methods of thermocouple integration. With that being said, the developed circuit shows promise as being capable of being configured into a conventional chipless RFID DC voltage sensor.
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Keywords:
chipless RFID sensors; thermocouple interfacing; voltage sensors; chipless RFID interrogation
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MDPI and ACS Style
Mc Gee, K.; Anandarajah, P.; Collins, D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines 2020, 11, 1019. https://doi.org/10.3390/mi11111019
AMA Style
Mc Gee K, Anandarajah P, Collins D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines. 2020; 11(11):1019. https://doi.org/10.3390/mi11111019
Chicago/Turabian StyleMc Gee, Kevin, Prince Anandarajah, and David Collins. 2020. "Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus" Micromachines 11, no. 11: 1019. https://doi.org/10.3390/mi11111019
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