Next Article in Journal
Localization and Actuation for MNPs Based on Magnetic Field-Free Point: Feasibility of Movable Electromagnetic Actuations
Next Article in Special Issue
An RFID-Based Self-Biased 40 nm Low Power LDO Regulator for IoT Applications
Previous Article in Journal
Processing Characteristics of Micro Electrical Discharge Machining for Surface Modification of TiNi Shape Memory Alloys Using a TiC Powder Dielectric
Previous Article in Special Issue
A 21 m Operation Range RFID Tag for “Pick to Light” Applications with a Photovoltaic Harvester
 
 
Article

Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus

1
School of Biotechnology, Dublin City University, Dublin 9, Ireland
2
The National Centre for Sensor Research (NCSR), Research & Engineering Building, Dublin City University, Dublin 9, Ireland
3
Photonics Systems and Sensing Laboratory, School of Electronic Engineering, Dublin City University, Dublin 9, Ireland
4
School of Electronic Engineering, Dublin City University, Dublin 9, Ireland
*
Author to whom correspondence should be addressed.
Micromachines 2020, 11(11), 1019; https://doi.org/10.3390/mi11111019
Received: 2 November 2020 / Revised: 16 November 2020 / Accepted: 18 November 2020 / Published: 20 November 2020
(This article belongs to the Special Issue Next Generation RFID Transponders)
To date, no printable chipless Radio Frequency Identification (RFID) sensor-related publications in the current literature discuss the possibility of thermocouple integration, particularly for the use in extreme environments. Furthermore, the effects of a time-dependent stimulus on the scattering parameters of a chipless RFID have never been discussed in the known literature. This work includes a review of possible methods to achieve this goal and the design and characterization of a Barium Strontium Titanate (BST) based VHF/UHF voltage sensing circuit. Proof-of-concept thermocouple integration was attempted, and subsequent testing was performed using a signal generator. These subsequent tests involved applying ramp and sinusoid voltage waveforms to the circuit and the characteristics of these signals are largely extracted from the scattering response. Overall conclusions of this paper are that thermocouple integration into chipless RFID technology is still a significant challenge and further work is needed to identify methods of thermocouple integration. With that being said, the developed circuit shows promise as being capable of being configured into a conventional chipless RFID DC voltage sensor. View Full-Text
Keywords: chipless RFID sensors; thermocouple interfacing; voltage sensors; chipless RFID interrogation chipless RFID sensors; thermocouple interfacing; voltage sensors; chipless RFID interrogation
Show Figures

Figure 1

MDPI and ACS Style

Mc Gee, K.; Anandarajah, P.; Collins, D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines 2020, 11, 1019. https://doi.org/10.3390/mi11111019

AMA Style

Mc Gee K, Anandarajah P, Collins D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines. 2020; 11(11):1019. https://doi.org/10.3390/mi11111019

Chicago/Turabian Style

Mc Gee, Kevin, Prince Anandarajah, and David Collins. 2020. "Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus" Micromachines 11, no. 11: 1019. https://doi.org/10.3390/mi11111019

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop