Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus
Mc Gee, K.; Anandarajah, P.; Collins, D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines 2020, 11, 1019. https://doi.org/10.3390/mi11111019
Mc Gee K, Anandarajah P, Collins D. Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus. Micromachines. 2020; 11(11):1019. https://doi.org/10.3390/mi11111019
Chicago/Turabian StyleMc Gee, Kevin, Prince Anandarajah, and David Collins. 2020. "Current Progress towards the Integration of Thermocouple and Chipless RFID Technologies and the Sensing of a Dynamic Stimulus" Micromachines 11, no. 11: 1019. https://doi.org/10.3390/mi11111019