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Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens

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Wood K plus—Competence Centre for Wood Composites and Wood Chemistry, Altenberger Straße 69, Linz 4040, Austria
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Department of Material Sciences and Process Engineering, Institute of Wood Technology and Renewable Resources, BOKU—University of Natural Resources and Life Sciences, Konrad Lorenzstraße 24, Tulln an der Donau 3430, Austria
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Department of Material Sciences and Process Engineering, Institute of Physics and Material Science, BOKU—University of Natural Resources and Life Sciences, Peter Jordan Straße 82, Vienna 1190, Austria
*
Author to whom correspondence should be addressed.
Materials 2012, 5(11), 2190-2204; https://doi.org/10.3390/ma5112190
Received: 13 September 2012 / Revised: 15 October 2012 / Accepted: 29 October 2012 / Published: 7 November 2012
(This article belongs to the Special Issue Creep and Fracture of Engineering Materials and Structures)
This paper is the third part of a study dealing with the mechanical and fracture mechanical characterization of Medium Density Fiberboards (MDF). In the first part, an analysis of internal bond strength testing was performed and in the second part MDF was analyzed by means of the wedge splitting experiment; this part deals with the double cantilever I beam test, which is designed for measuring the fracture energy as well as stress intensity factor in Mode I. For a comparison of isotropic and orthotropic material behavior, finite element modeling was performed. In addition to the calculation of fracture energy the stress intensity factor was analyzed by means of finite elements simulation and calculation. In order to analyze strain deformations and the process zone, electronic speckle pattern interferometry measurements were performed. The results revealed an elongated process zone and lower results for KIC if compared to the wedge splitting experiment. The Gf numbers are higher compared to the wedge splitting results and can be explained by the thicker process zone formed during the crack propagation. The process zone width on its part is influenced by the stiff reinforcements and yields a similar crack surface as with the internal bond test. View Full-Text
Keywords: double cantilever I-beam test; electronic speckle pattern interferometry; fracture mechanics; fracture energy; medium density fiber board double cantilever I-beam test; electronic speckle pattern interferometry; fracture mechanics; fracture energy; medium density fiber board
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Rathke, J.; Müller, U.; Konnerth, J.; Sinn, G. Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens. Materials 2012, 5, 2190-2204.

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