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Journal: Materials, 2024
Volume: 17
Number: 2158

Article: Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material
Authors: by Chao-Hong Wang, Chun-Wei Chiu and Mei-Hau Li
Link: https://www.mdpi.com/1996-1944/17/9/2158

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