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Journal: Materials, 2024
Volume: 17
Number: 2015
Article:
Microstructure Evolution and Recrystallization Mechanisms of a Cu–Cr–Sn Alloy during Thermal Deformation Process
Authors:
by
Qian Yu, Zhen Yang, Lijun Peng, Haofeng Xie, Yicheng Cao, Yunqing Zhu and Feng Liu
Link:
https://www.mdpi.com/1996-1944/17/9/2015
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